Nowadays, the popular mobile phone screen process has COG,COF and COP, and many people may not know the difference, so today I will explain the difference between these three processes:

COP stands for “Chip On Pi”,The principle of COP screen packaging is to directly bend a part of the screen, thereby further reducing the border, which can achieve a near-bezel-free effect. However, due to the need for screen bending, models using the COP screen packaging process need to be equipped with OLED flexible screens.For example,The iphone x uses this process.

COG stands for “Chip On Glass”.It is currently the most traditional screen packaging process, but also the most cost-effective solution, widely used. Before the full screen has not formed a trend, most mobile phones are using COG screen packaging process, because the chip is placed directly above the glass, so the utilization rate of mobile phone space is low, and the screen proportion is not high.

COF stands for “Chip On Film”.This screen packaging process is to integrate the IC chip of the screen on the FPC of a flexible material, and then bend it to the bottom of the screen, which can further reduce the border and increase the screen proportion compared to COG’s solution.

Overall, it can be concluded that: COP > COF > COG, COP package is the most advanced, but the cost of COP is also the highest, followed by COP, and finally is the most economical COG. In the era of full-screen mobile phones, the screen proportion often has a great relationship with the screen packaging process.